[1] Xakalashe, B.S. and Tangstad, M., Silicon processing: from quartz to crystalline silicon solar cells, Chem Technol, (March), pp.6-9, 2012.
[2] Van Mierlo, F., Jonczyk, R. and Qian, V., Next generation Direct Wafer® technology delivers low cost, high performance to silicon wafer industry. Energy Procedia, Vol. 130, pp.2-6, 2017.
[3] Lorenz, A., Kerfless Silicon Precursor Wafer Formed by Rapid Solidification: October 2009-March 2010 (No. NREL/SR-5200-51934). National Renewable Energy Lab. (NREL), Golden, CO (United States), 2011.
[4] Montgomery, J., 1366 Technologies Opens New Factory. Paves Road to Cheaper Solar PV, RenewableEnergyWorld, 1, 2013.
[5] Brailove, A., Kang, S., Fujisaka, A. and Henley, F., First demonstration of high volume manufacturing of kerf-free polymax wafers. In Proc. of the 25th European Photovoltaic Solar Energy Conf (p. 1613), 2010.
[6] Fujisaka, A., Keeping Pace with Cost Reduction as Module Prices Continue to Decline. Photovoltaics World, pp.38-41, 2010.
[7] Henley, F., Kang, S., Liu, Z., Tian, L., Wang, J. and Chow, Y.L., June. Beam-induced wafering technology for kerf-free thin PV manufacturing. In 2009 34th IEEE Photovoltaic Specialists Conference (PVSC) (pp. 001718-001723). IEEE, 2009.
[8] Fujisaka, A., Kang, S., Tian, L., Chow, Y.L. and Belyaev, A., Implant-cleave process enables ultra-thin wafers without kerf loss. Photovoltaics World, pp.21-24, 2011.
[9] Standard, A.S.T.M., Standard test method for monotonic equibiaxial flexural strength of advanced ceramics at ambient temperature. Standard ASTM C1499-04, West Conshohocken, 2005.
[10] Coletti, G., Van Der Borg, N.J.C.M., De Iuliis, S., Tool, C.J.J. and Geerligs, L.J., Mechanical strength of silicon wafers depending on wafer thickness and surface treatment, Vol. 2000, No.80, p.86, 2006.
[11] SEMI PV Group, PV Technology Roadmap Forum. Germany, June, 2010.
[12] Dross, F., Milhe, A., Robbelein, J., Gordon, I., Bouchard, P.O., Beaucarne, G. and Poortmans, J., May. Stress-induced lift-off method for kerf-loss-free wafering of ultra-thin (∼ 50 μm) crystalline Si wafers. In 2008 33rd IEEE Photovoltaic Specialists Conference (pp. 1-5). IEEE, 2008.
[13] Kajari-Schröder, S., Käsewieter, J., Hensen, J. and Brendel, R., Lift-off of free-standing layers in the kerfless porous silicon process. Energy Procedia, Vol. 38, pp.919-925, 2013.
[14] Li, N., Habuka, H., Ikeda, S.I. and Hara, S., Silicon chemical vapor deposition process using a half-inch silicon wafer for Minimal Manufacturing System. Physics Procedia,Vol. 46, pp.230-238, 2013.
[15] Nakayashiki, K., Rousaville, B., Yelundur, V., Kim, D.S., Rohatgi, A., Clark-Phelps, R. and Hanoka, J.I., Fabrication and analysis of high-efficiency String Ribbon Si solar cells. Solid-state electronics, Vol 50, pp. 1406-1412, 2006.
)
